Effect of intermetallic stabilization on the impact resistance of joints to BGA packages

Keith Sweatman, Shoichi Suenaga, M. Miyaoka, Takashi Nozu, Kazuhiro Nogita, Tetsuro Nishimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

To the extent that it provides a potential low energy route for crack propagation the intermetallic compound that forms at the interface between a tin-based solder and the substrate can play a critical role in determining the likelihood of joint failure in impact loading such as can occur when portable devices are accidentally dropped. While it has been clearly documented in the standard equilibrium phase diagrams the implication of the allotropic change in the Cu6Sn5 intermetallic from a closepacked hexagonal to monoclinic crystal structure at 186° C with an accompanying 2.15% increase in volume has been found to have implications for the mechanical integrity of the interfacial intermetallic that were not previously recognized. In this paper the authors report the effect of a trace addition of Ni in permanently stabilizing the high-temperature form of the Cu6Sn5 to room temperature on the response to high speed shear of Sn-0.7Cu spheres reflowed to a copper substrate. By reducing the incidence of incipient cracking in the intermetallic layer the stress required to initiate cracking and the energy required for crack propagation are significantly increased with consequent benefits for the impact resistance of the solder joint.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages331-335
Number of pages5
DOIs
Publication statusPublished - Dec 1 2009
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: Dec 9 2009Dec 11 2009

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
CountrySingapore
CitySingapore
Period12/9/0912/11/09

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'Effect of intermetallic stabilization on the impact resistance of joints to BGA packages'. Together they form a unique fingerprint.

  • Cite this

    Sweatman, K., Suenaga, S., Miyaoka, M., Nozu, T., Nogita, K., & Nishimura, T. (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. In EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference (pp. 331-335). [5416526] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2009.5416526