Effect of Ni on phase stability and thermal expansion of Cu 6-xNi xSn 5 (X = 0, 0.5, 1, 1.5 and 2)

Kazuhiro Nogita, D. Mu, S. D. McDonald, J. Read, Y. Q. Wu

Research output: Contribution to journalArticle

45 Citations (Scopus)

Abstract

The crystallography of the Cu 6Sn 5 intermetallic that forms at the solder-substrate interface in many soldering operations can be influenced by Ni additions. It has been established that when Ni is present at 5-9 at%, the high-temperature hexagonal Cu 6Sn 5 (η) does not transition to the low-temperature monoclinic Cu 6Sn 5 (η′) at the equilibrium temperature of 186°C. In fact, the hexagonal phase remains stable from room temperature to 250°C. This paper shows the stabilising effect of Ni exists in the range of 4.6-17.2 at% Ni in stoichiometric samples, over the larger temperature range of -100 to 250°C using synchrotron X-ray diffraction. The results are also used in combination with dilatometry experiments and show that Ni decreases the magnitude of thermal expansion, and prevents the discontinuity in expansion that occurs with the polymorphic transformation.

Original languageEnglish
Pages (from-to)78-85
Number of pages8
JournalIntermetallics
Volume26
DOIs
Publication statusPublished - Jul 1 2012

Fingerprint

Phase stability
Thermal expansion
Temperature
Crystallography
Soldering
Synchrotrons
Soldering alloys
Intermetallics
X ray diffraction
Substrates
Experiments

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this

Effect of Ni on phase stability and thermal expansion of Cu 6-xNi xSn 5 (X = 0, 0.5, 1, 1.5 and 2). / Nogita, Kazuhiro; Mu, D.; McDonald, S. D.; Read, J.; Wu, Y. Q.

In: Intermetallics, Vol. 26, 01.07.2012, p. 78-85.

Research output: Contribution to journalArticle

Nogita, Kazuhiro ; Mu, D. ; McDonald, S. D. ; Read, J. ; Wu, Y. Q. / Effect of Ni on phase stability and thermal expansion of Cu 6-xNi xSn 5 (X = 0, 0.5, 1, 1.5 and 2). In: Intermetallics. 2012 ; Vol. 26. pp. 78-85.
@article{af8fc0e7353541979162f91bc59ec889,
title = "Effect of Ni on phase stability and thermal expansion of Cu 6-xNi xSn 5 (X = 0, 0.5, 1, 1.5 and 2)",
abstract = "The crystallography of the Cu 6Sn 5 intermetallic that forms at the solder-substrate interface in many soldering operations can be influenced by Ni additions. It has been established that when Ni is present at 5-9 at{\%}, the high-temperature hexagonal Cu 6Sn 5 (η) does not transition to the low-temperature monoclinic Cu 6Sn 5 (η′) at the equilibrium temperature of 186°C. In fact, the hexagonal phase remains stable from room temperature to 250°C. This paper shows the stabilising effect of Ni exists in the range of 4.6-17.2 at{\%} Ni in stoichiometric samples, over the larger temperature range of -100 to 250°C using synchrotron X-ray diffraction. The results are also used in combination with dilatometry experiments and show that Ni decreases the magnitude of thermal expansion, and prevents the discontinuity in expansion that occurs with the polymorphic transformation.",
author = "Kazuhiro Nogita and D. Mu and McDonald, {S. D.} and J. Read and Wu, {Y. Q.}",
year = "2012",
month = "7",
day = "1",
doi = "10.1016/j.intermet.2012.03.047",
language = "English",
volume = "26",
pages = "78--85",
journal = "Intermetallics",
issn = "0966-9795",
publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Effect of Ni on phase stability and thermal expansion of Cu 6-xNi xSn 5 (X = 0, 0.5, 1, 1.5 and 2)

AU - Nogita, Kazuhiro

AU - Mu, D.

AU - McDonald, S. D.

AU - Read, J.

AU - Wu, Y. Q.

PY - 2012/7/1

Y1 - 2012/7/1

N2 - The crystallography of the Cu 6Sn 5 intermetallic that forms at the solder-substrate interface in many soldering operations can be influenced by Ni additions. It has been established that when Ni is present at 5-9 at%, the high-temperature hexagonal Cu 6Sn 5 (η) does not transition to the low-temperature monoclinic Cu 6Sn 5 (η′) at the equilibrium temperature of 186°C. In fact, the hexagonal phase remains stable from room temperature to 250°C. This paper shows the stabilising effect of Ni exists in the range of 4.6-17.2 at% Ni in stoichiometric samples, over the larger temperature range of -100 to 250°C using synchrotron X-ray diffraction. The results are also used in combination with dilatometry experiments and show that Ni decreases the magnitude of thermal expansion, and prevents the discontinuity in expansion that occurs with the polymorphic transformation.

AB - The crystallography of the Cu 6Sn 5 intermetallic that forms at the solder-substrate interface in many soldering operations can be influenced by Ni additions. It has been established that when Ni is present at 5-9 at%, the high-temperature hexagonal Cu 6Sn 5 (η) does not transition to the low-temperature monoclinic Cu 6Sn 5 (η′) at the equilibrium temperature of 186°C. In fact, the hexagonal phase remains stable from room temperature to 250°C. This paper shows the stabilising effect of Ni exists in the range of 4.6-17.2 at% Ni in stoichiometric samples, over the larger temperature range of -100 to 250°C using synchrotron X-ray diffraction. The results are also used in combination with dilatometry experiments and show that Ni decreases the magnitude of thermal expansion, and prevents the discontinuity in expansion that occurs with the polymorphic transformation.

UR - http://www.scopus.com/inward/record.url?scp=84860215189&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860215189&partnerID=8YFLogxK

U2 - 10.1016/j.intermet.2012.03.047

DO - 10.1016/j.intermet.2012.03.047

M3 - Article

AN - SCOPUS:84860215189

VL - 26

SP - 78

EP - 85

JO - Intermetallics

JF - Intermetallics

SN - 0966-9795

ER -