Effect of Ni on phase stability and thermal expansion of Cu _6-xNi _xSn ₅ (X = 0, 0.5, 1, 1.5 and 2)

Physics

• Temperature 100%
• Dilatometry 66%
• Thermal Expansion 66%
• Synchrotron X-Ray Diffraction 66%
• Substrates 33%
• Intermetallics 33%
• High Temperature 33%
• Stability 33%
• Room Temperature 33%
• Expansion 33%
• Magnitude 33%
• Discontinuity 33%
• Crystallography 33%

Material Science

• Thermal Expansion 66%
• Intermetallics 33%
• Expansion 33%