Effect of reflow conditions on the intermetallic layer in solder joints

K. Nogita, F. Somidin, M. A.A. Mohd Salleh, K. Sweatman, T. Nishimura, S. D. McDonald, H. Maeno, S. Matsumura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The Cu6Sn5 intermetallic formed between Pb-free Sn-based solders and Cu substrates plays a critical role in the reliability of solder joints. Cu6Sn5 can adopt at least two different crystal structures over the temperature range to which electronics circuitry is exposed during assembly and service. Under equilibrium conditions the change from a hexagonal to monoclinic structure occurs on cooling solder joints below 186°C. However, cooling rates associated with common commercial soldering processes are typically faster than the rate that would permit complete transformation. In this paper the authors report a study on the effect of reflow cooling conditions on Cu6Sn5 crystal structure. The findings have important implications for the manufacture of solder joints and their in-service performance.

Original languageEnglish
Title of host publication2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages94-96
Number of pages3
ISBN (Electronic)9784990218850
DOIs
Publication statusPublished - Jun 6 2018
Event2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
Duration: Apr 17 2018Apr 21 2018

Publication series

Name2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
CountryJapan
CityKuwana, Mie
Period4/17/184/21/18

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

Fingerprint Dive into the research topics of 'Effect of reflow conditions on the intermetallic layer in solder joints'. Together they form a unique fingerprint.

Cite this