Effect of silicon on the age softening of high carbon steel wire

T. Tarui, T. Takahashi, S. Ohashi, Ryuji Uemori

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

The effect of silicon on age softening was investigated in high carbon wires cold drawn (79 percent reduction) and aged for one minute. The peak of strain age hardening took place at 250 °C. The amount of age hardening increased with increasing strain, but not with the silicon content. The yield strength began to decrease at temperatures above 400 °C. Increase in silicon content diminished the amount of strength reduction. The effect of silicon on the suppression of age softening may be caused by a decrease of in the breakup and spheroidization of lamellar cementite in view of the existence of high silicon concentration areas near the ferrite-cementite interfaces.

Original languageEnglish
Pages (from-to)25-30
Number of pages6
JournalI & SM
Volume21
Issue number9
Publication statusPublished - Sep 1994
Externally publishedYes

Fingerprint

Carbon steel
Wire
Silicon
Age hardening
Strain hardening
Yield stress
Ferrite
Carbon
Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Tarui, T., Takahashi, T., Ohashi, S., & Uemori, R. (1994). Effect of silicon on the age softening of high carbon steel wire. I & SM, 21(9), 25-30.

Effect of silicon on the age softening of high carbon steel wire. / Tarui, T.; Takahashi, T.; Ohashi, S.; Uemori, Ryuji.

In: I & SM, Vol. 21, No. 9, 09.1994, p. 25-30.

Research output: Contribution to journalArticle

Tarui, T, Takahashi, T, Ohashi, S & Uemori, R 1994, 'Effect of silicon on the age softening of high carbon steel wire', I & SM, vol. 21, no. 9, pp. 25-30.
Tarui T, Takahashi T, Ohashi S, Uemori R. Effect of silicon on the age softening of high carbon steel wire. I & SM. 1994 Sep;21(9):25-30.
Tarui, T. ; Takahashi, T. ; Ohashi, S. ; Uemori, Ryuji. / Effect of silicon on the age softening of high carbon steel wire. In: I & SM. 1994 ; Vol. 21, No. 9. pp. 25-30.
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