Effect of surface microstructure on boiling heat transfer from silicon chips immersed in FC-72

Hiroshi Takamatsu, Hiroshi Honda, J. J. Wei

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Thermal science and engineering
Volume	10
Publication status	Published - Sept 2002

Cite this

@article{59bac7f5616b4352815e1e4ad4576cf3,

title = "Effect of surface microstructure on boiling heat transfer from silicon chips immersed in FC-72",

author = "Hiroshi Takamatsu and Hiroshi Honda and Wei, {J. J.}",

year = "2002",

month = sep,

language = "English",

volume = "10",

journal = "Thermal science and engineering",

issn = "0918-9963",

publisher = "Heat Transfer Society of Japan",

}