Effect of the size of micro-pin-fin on boiling heat transfer from silicon chips immersed in FC-72

Engineering

• Heat Flux 100%
• Surfaces 66%
• Experiments 66%
• Boiling Heat Transfer 66%
• Dissolved Gas 66%
• Temperature 33%
• Steep Increase 33%
• Dry Etching 33%
• Boiling Curve 33%
• Reliable Operation 33%
• Atmospheric Condition 33%
• Nucleate Boiling 33%
• Boiling Liquid 33%
• Upper Limit 33%
• Gas Content 33%

Physics

• Silicon 100%
• Dimensions 66%
• Liquids 66%
• Heat Transfer Enhancement for Application 66%
• Temperature 33%
• Increasing 33%
• Region 33%
• Nucleate Boiling 33%
• Boiling 33%
• Meteorology 33%

Chemical Engineering

• Silicon 100%
• Heat Flux 100%
• Temperature 33%