TY - JOUR
T1 - Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering
AU - Mohd Salleh, M. A.A.
AU - Said, R. M.
AU - Saud, N.
AU - Yasuda, H.
AU - McDonald, S. D.
AU - Nogita, K.
N1 - Funding Information:
This project is financial support from the University of Queensland (UQ)-Nihon Superior (NS) collaboration research project, Universiti Malaysia Perlis (UniMAP)-Nihon Superior (NS) collaboration research project, ARC Linkage project (LP140100485), and a Grant-in-Aid for Scientific Research (S) (24226018) from JSPS, Japan. The authors thank Dr. K. Uesugi and Dr. A. Takeuchi of SPring-8, Professor A. Sugiyama from the Osaka Sangyo University, Dr. T. Nagira from Osaka University and students from the Department of Materials Science and Engineering, Kyoto University. Real-time observation experiments were performed at the SPring-8 BL20XU (2014B1620 and 2015A1675). We acknowledge travel funding provided by the Australian Synchrotron International Synchrotron Access Program (AS/IA143/9218 and AS/IA151/9538) managed by the Australian Synchrotron and funded by the Australian government.
Publisher Copyright:
© 2016 Trans Tech Publications, Switzerland.
PY - 2016
Y1 - 2016
N2 - This paper investigates the effect of 1 wt% TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder pastes soldered on a Cu substrate using a real-time synchrotron imaging technique. It was found that TiO2 had altered the nucleation time of the primary Cu6Sn5 intermetallics and increased the number of particles observed. In addition, a more planar Cu6Sn5 interfacial layer had formed in joints made with TiO2 reinforced solders. This indicated that TiO2 promotes nucleation of primary Cu6Sn5 intermetallics in the early stages of soldering while being a barrier for further growth of interfacial Cu6Sn5 intermetallics. The synchrotron imaging technique provides direct evidence of the sequence of events in the soldering reaction and how these are influenced by TiO2 reinforcement.
AB - This paper investigates the effect of 1 wt% TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder pastes soldered on a Cu substrate using a real-time synchrotron imaging technique. It was found that TiO2 had altered the nucleation time of the primary Cu6Sn5 intermetallics and increased the number of particles observed. In addition, a more planar Cu6Sn5 interfacial layer had formed in joints made with TiO2 reinforced solders. This indicated that TiO2 promotes nucleation of primary Cu6Sn5 intermetallics in the early stages of soldering while being a barrier for further growth of interfacial Cu6Sn5 intermetallics. The synchrotron imaging technique provides direct evidence of the sequence of events in the soldering reaction and how these are influenced by TiO2 reinforcement.
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U2 - 10.4028/www.scientific.net/KEM.700.161
DO - 10.4028/www.scientific.net/KEM.700.161
M3 - Article
AN - SCOPUS:84978759617
VL - 700
SP - 161
EP - 169
JO - Key Engineering Materials
JF - Key Engineering Materials
SN - 1013-9826
ER -