Abstract
This paper investigates the effect of 1 wt% TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder pastes soldered on a Cu substrate using a real-time synchrotron imaging technique. It was found that TiO2 had altered the nucleation time of the primary Cu6Sn5 intermetallics and increased the number of particles observed. In addition, a more planar Cu6Sn5 interfacial layer had formed in joints made with TiO2 reinforced solders. This indicated that TiO2 promotes nucleation of primary Cu6Sn5 intermetallics in the early stages of soldering while being a barrier for further growth of interfacial Cu6Sn5 intermetallics. The synchrotron imaging technique provides direct evidence of the sequence of events in the soldering reaction and how these are influenced by TiO2 reinforcement.
| Original language | English |
|---|---|
| Pages (from-to) | 161-169 |
| Number of pages | 9 |
| Journal | Key Engineering Materials |
| Volume | 700 |
| DOIs | |
| Publication status | Published - Jan 1 2016 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
Cite this
Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. / Mohd Salleh, M. A A; Said, R. M.; Saud, N.; Yasuda, H.; McDonald, S. D.; Nogita, Kazuhiro.
In: Key Engineering Materials, Vol. 700, 01.01.2016, p. 161-169.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering
AU - Mohd Salleh, M. A A
AU - Said, R. M.
AU - Saud, N.
AU - Yasuda, H.
AU - McDonald, S. D.
AU - Nogita, Kazuhiro
PY - 2016/1/1
Y1 - 2016/1/1
N2 - This paper investigates the effect of 1 wt% TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder pastes soldered on a Cu substrate using a real-time synchrotron imaging technique. It was found that TiO2 had altered the nucleation time of the primary Cu6Sn5 intermetallics and increased the number of particles observed. In addition, a more planar Cu6Sn5 interfacial layer had formed in joints made with TiO2 reinforced solders. This indicated that TiO2 promotes nucleation of primary Cu6Sn5 intermetallics in the early stages of soldering while being a barrier for further growth of interfacial Cu6Sn5 intermetallics. The synchrotron imaging technique provides direct evidence of the sequence of events in the soldering reaction and how these are influenced by TiO2 reinforcement.
AB - This paper investigates the effect of 1 wt% TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder pastes soldered on a Cu substrate using a real-time synchrotron imaging technique. It was found that TiO2 had altered the nucleation time of the primary Cu6Sn5 intermetallics and increased the number of particles observed. In addition, a more planar Cu6Sn5 interfacial layer had formed in joints made with TiO2 reinforced solders. This indicated that TiO2 promotes nucleation of primary Cu6Sn5 intermetallics in the early stages of soldering while being a barrier for further growth of interfacial Cu6Sn5 intermetallics. The synchrotron imaging technique provides direct evidence of the sequence of events in the soldering reaction and how these are influenced by TiO2 reinforcement.
UR - http://www.scopus.com/inward/record.url?scp=84978759617&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84978759617&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.700.161
DO - 10.4028/www.scientific.net/KEM.700.161
M3 - Article
AN - SCOPUS:84978759617
VL - 700
SP - 161
EP - 169
JO - Key Engineering Materials
JF - Key Engineering Materials
SN - 1013-9826
ER -