Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering

M. A.A. Mohd Salleh, R. M. Said, N. Saud, H. Yasuda, S. D. McDonald, K. Nogita

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Chemical Compounds

Engineering & Materials Science