Effect of Zn, Au, and in on the polymorphic phase transformation in Cu 6Sn 5 intermetallics

Guang Zeng, Stuart D. McDonald, Qinfen Gu, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

Cu 6Sn 5 is a critical intermetallic compound in soldering operations. Conventional equilibrium phase diagrams show that this compound is of either a hexagonal or monoclinic structure at temperatures above and below 186 °C, respectively. Under nonequilibrium conditions, the crystal structure is dependent on composition, temperature, and processing history. The effect of Zn, Au, and In on the hexagonal to monoclinic polymorphic transformation in Cu 6Sn 5 intermetallics is investigated using variable temperature synchrotron powder x-ray diffraction and differential scanning calorimetry. It is revealed that, as in the case of trace Ni additions, the alloying elements Zn and Au completely stabilize the hexagonal Cu 6Sn 5 and prevent the phase transformation. In contrast, In additions only partially stabilize the hexagonal Cu 6Sn 5.

Original languageEnglish
Pages (from-to)2609-2614
Number of pages6
JournalJournal of Materials Research
Volume27
Issue number20
DOIs
Publication statusPublished - Oct 28 2012

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Effect of Zn, Au, and in on the polymorphic phase transformation in Cu <sub>6</sub>Sn <sub>5</sub> intermetallics'. Together they form a unique fingerprint.

Cite this