Effects of additives on the surface roughness and throwing power of copper deposited from electrorefining solutions

Atsuhiro Suzuki, Satoshi Oue, Shigeo Kobayashi, Hiroaki Nakano

Research output: Contribution to journalArticle

Abstract

To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m−2 and a charge of 5 × 105 C·m−2 in an unagitated sulfate solution containing 0.708 mol·dm−3 of CuSO4 and 2.04 mol·dm−3 of H2SO4 at a temperature of 60C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was significantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses.

Original languageEnglish
Pages (from-to)1538-1545
Number of pages8
JournalMaterials Transactions
Volume58
Issue number11
DOIs
Publication statusPublished - Jan 1 2017

Fingerprint

electrorefining
throwing
gelatins
Gelatin
Thiourea
Thioureas
thioureas
Copper
surface roughness
Surface roughness
Chlorides
copper
chlorides
Ions
ions
Polarization
recesses
Depolarization
promotion
polarization

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Effects of additives on the surface roughness and throwing power of copper deposited from electrorefining solutions. / Suzuki, Atsuhiro; Oue, Satoshi; Kobayashi, Shigeo; Nakano, Hiroaki.

In: Materials Transactions, Vol. 58, No. 11, 01.01.2017, p. 1538-1545.

Research output: Contribution to journalArticle

@article{b979c91a856d46fb9e05d980cb82ec29,
title = "Effects of additives on the surface roughness and throwing power of copper deposited from electrorefining solutions",
abstract = "To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m−2 and a charge of 5 × 105 C·m−2 in an unagitated sulfate solution containing 0.708 mol·dm−3 of CuSO4 and 2.04 mol·dm−3 of H2SO4 at a temperature of 60C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was significantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses.",
author = "Atsuhiro Suzuki and Satoshi Oue and Shigeo Kobayashi and Hiroaki Nakano",
year = "2017",
month = "1",
day = "1",
doi = "10.2320/matertrans.M2017215",
language = "English",
volume = "58",
pages = "1538--1545",
journal = "Materials Transactions",
issn = "0916-1821",
publisher = "The Japan Institute of Metals and Materials",
number = "11",

}

TY - JOUR

T1 - Effects of additives on the surface roughness and throwing power of copper deposited from electrorefining solutions

AU - Suzuki, Atsuhiro

AU - Oue, Satoshi

AU - Kobayashi, Shigeo

AU - Nakano, Hiroaki

PY - 2017/1/1

Y1 - 2017/1/1

N2 - To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m−2 and a charge of 5 × 105 C·m−2 in an unagitated sulfate solution containing 0.708 mol·dm−3 of CuSO4 and 2.04 mol·dm−3 of H2SO4 at a temperature of 60C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was significantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses.

AB - To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m−2 and a charge of 5 × 105 C·m−2 in an unagitated sulfate solution containing 0.708 mol·dm−3 of CuSO4 and 2.04 mol·dm−3 of H2SO4 at a temperature of 60C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was significantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses.

UR - http://www.scopus.com/inward/record.url?scp=85032199901&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85032199901&partnerID=8YFLogxK

U2 - 10.2320/matertrans.M2017215

DO - 10.2320/matertrans.M2017215

M3 - Article

VL - 58

SP - 1538

EP - 1545

JO - Materials Transactions

JF - Materials Transactions

SN - 0916-1821

IS - 11

ER -