Effects of current densities on the lithium plating morphology at a lithium phosphorus oxynitride glass electrolyte/copper thin film interface

Fumihiro Sagane, Ken Ichi Ikeda, Kengo Okita, Hikaru Sano, Hikari Sakaebe, Yasutoshi Iriyama

Research output: Contribution to journalArticlepeer-review

57 Citations (Scopus)

Abstract

Lithium metal (Li) is electrochemically-grown at the lithium phosphorus oxynitride glass electrolyte (LiPON)/copper (Cu) thin film interface. The plated lithium morphology depends on the current densities, and larger current densities bring about smaller-sized precipitation of Li with larger coverage ratio by the precipitates. Both scanning electron microscopy and in-situ optical microscopy observations reveal that the lithium tends to grow at the lithium pre-plated place. Large potential drop was observed at the initial lithium plating process, suggesting that the nucleation process requires large activation energy at the initial lithium plating process at the LiPON/Cu interface. The resultant morphology-controlled in-situ prepared Li provides stable and low-resistive Li/LiPON interface compared with the vacuum-evaporated Li thin film.

Original languageEnglish
Pages (from-to)34-42
Number of pages9
JournalJournal of Power Sources
Volume233
DOIs
Publication statusPublished - 2013
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Renewable Energy, Sustainability and the Environment
  • Energy Engineering and Power Technology
  • Physical and Theoretical Chemistry
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Effects of current densities on the lithium plating morphology at a lithium phosphorus oxynitride glass electrolyte/copper thin film interface'. Together they form a unique fingerprint.

Cite this