Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

M. A.A. Mohd Salleh; S. D. McDonald; K. Nogita

doi:10.1016/j.jmatprotec.2016.11.031

Effects of Ni and TiO₂ additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

M. A.A. Mohd Salleh, S. D. McDonald, K. Nogita

Faculty of Engineering

Research output: Contribution to journal › Article

23 Citations (Scopus)

Abstract

The growth of Cu₆Sn₅ and Cu₃Sn₅ interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO₂ and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO₂ additions, a more planar scalloped Cu₆Sn₅ morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)₆Sn₅ layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO₂ even after annealing which resulted in superior shear strength and fracture energy.

Original language	English
Pages (from-to)	235-245
Number of pages	11
Journal	Journal of Materials Processing Technology
Volume	242
DOIs	https://doi.org/10.1016/j.jmatprotec.2016.11.031
Publication status	Published - Apr 1 2017

All Science Journal Classification (ASJC) codes

Ceramics and Composites
Computer Science Applications
Metals and Alloys
Industrial and Manufacturing Engineering

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Mohd Salleh, M. A. A., McDonald, S. D., & Nogita, K. (2017). Effects of Ni and TiO₂ additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. https://doi.org/10.1016/j.jmatprotec.2016.11.031

@article{46428edf463f4116b082f2b5ec99b278,

title = "Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates",

abstract = "The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)6Sn5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy.",

author = "{Mohd Salleh}, {M. A.A.} and McDonald, {S. D.} and K. Nogita",

year = "2017",

month = apr,

day = "1",

doi = "10.1016/j.jmatprotec.2016.11.031",

language = "English",

volume = "242",

pages = "235--245",

journal = "Journal of Materials Processing Technology",

issn = "0924-0136",

publisher = "Elsevier BV",

}

TY - JOUR

T1 - Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

AU - Mohd Salleh, M. A.A.

AU - McDonald, S. D.

AU - Nogita, K.

PY - 2017/4/1

Y1 - 2017/4/1

N2 - The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)6Sn5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy.

AB - The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)6Sn5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy.

UR - http://www.scopus.com/inward/record.url?scp=85002543900&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85002543900&partnerID=8YFLogxK

U2 - 10.1016/j.jmatprotec.2016.11.031

DO - 10.1016/j.jmatprotec.2016.11.031

M3 - Article

AN - SCOPUS:85002543900

VL - 242

SP - 235

EP - 245

JO - Journal of Materials Processing Technology

JF - Journal of Materials Processing Technology

SN - 0924-0136

ER -