Abstract
The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)6Sn5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy.
| Original language | English |
|---|---|
| Pages (from-to) | 235-245 |
| Number of pages | 11 |
| Journal | Journal of Materials Processing Technology |
| Volume | 242 |
| DOIs | |
| Publication status | Published - Apr 1 2017 |
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All Science Journal Classification (ASJC) codes
- Ceramics and Composites
- Computer Science Applications
- Metals and Alloys
- Industrial and Manufacturing Engineering
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Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. / Mohd Salleh, M. A.A.; McDonald, S. D.; Nogita, K.
In: Journal of Materials Processing Technology, Vol. 242, 01.04.2017, p. 235-245.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates
AU - Mohd Salleh, M. A.A.
AU - McDonald, S. D.
AU - Nogita, K.
PY - 2017/4/1
Y1 - 2017/4/1
N2 - The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)6Sn5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy.
AB - The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)6Sn5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy.
UR - http://www.scopus.com/inward/record.url?scp=85002543900&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85002543900&partnerID=8YFLogxK
U2 - 10.1016/j.jmatprotec.2016.11.031
DO - 10.1016/j.jmatprotec.2016.11.031
M3 - Article
AN - SCOPUS:85002543900
VL - 242
SP - 235
EP - 245
JO - Journal of Materials Processing Technology
JF - Journal of Materials Processing Technology
SN - 0924-0136
ER -