Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder

Kazuhiro Nogita, C. M. Gourlay, J. Read, T. Nishimura, S. Suenaga, A. K. Dahle

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0-0.08 mass% phosphorous. Ppm levels of phosphorous are found to cause Sn-JrP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds ∼0.01 mass% P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.

Original languageEnglish
Pages (from-to)443-448
Number of pages6
JournalMaterials Transactions
Volume49
Issue number3
DOIs
Publication statusPublished - Mar 1 2008

Fingerprint

Fluidity
solders
Phosphorus
phosphorus
Soldering alloys
microstructure
Microstructure
floats
Liquids
dendrites
liquids
Buoyancy
buoyancy
eutectics
Eutectics
solidification
Intermetallics
intermetallics
Solidification
baths

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Nogita, K., Gourlay, C. M., Read, J., Nishimura, T., Suenaga, S., & Dahle, A. K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49(3), 443-448. https://doi.org/10.2320/matertrans.MBW200713

Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. / Nogita, Kazuhiro; Gourlay, C. M.; Read, J.; Nishimura, T.; Suenaga, S.; Dahle, A. K.

In: Materials Transactions, Vol. 49, No. 3, 01.03.2008, p. 443-448.

Research output: Contribution to journalArticle

Nogita, K, Gourlay, CM, Read, J, Nishimura, T, Suenaga, S & Dahle, AK 2008, 'Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder', Materials Transactions, vol. 49, no. 3, pp. 443-448. https://doi.org/10.2320/matertrans.MBW200713
Nogita, Kazuhiro ; Gourlay, C. M. ; Read, J. ; Nishimura, T. ; Suenaga, S. ; Dahle, A. K. / Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. In: Materials Transactions. 2008 ; Vol. 49, No. 3. pp. 443-448.
@article{25c1b1aba89644b1afe5d595db87d653,
title = "Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder",
abstract = "Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0-0.08 mass{\%} phosphorous. Ppm levels of phosphorous are found to cause Sn-JrP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds ∼0.01 mass{\%} P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.",
author = "Kazuhiro Nogita and Gourlay, {C. M.} and J. Read and T. Nishimura and S. Suenaga and Dahle, {A. K.}",
year = "2008",
month = "3",
day = "1",
doi = "10.2320/matertrans.MBW200713",
language = "English",
volume = "49",
pages = "443--448",
journal = "Materials Transactions",
issn = "0916-1821",
publisher = "The Japan Institute of Metals and Materials",
number = "3",

}

TY - JOUR

T1 - Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder

AU - Nogita, Kazuhiro

AU - Gourlay, C. M.

AU - Read, J.

AU - Nishimura, T.

AU - Suenaga, S.

AU - Dahle, A. K.

PY - 2008/3/1

Y1 - 2008/3/1

N2 - Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0-0.08 mass% phosphorous. Ppm levels of phosphorous are found to cause Sn-JrP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds ∼0.01 mass% P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.

AB - Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0-0.08 mass% phosphorous. Ppm levels of phosphorous are found to cause Sn-JrP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds ∼0.01 mass% P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.

UR - http://www.scopus.com/inward/record.url?scp=42349113410&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=42349113410&partnerID=8YFLogxK

U2 - 10.2320/matertrans.MBW200713

DO - 10.2320/matertrans.MBW200713

M3 - Article

VL - 49

SP - 443

EP - 448

JO - Materials Transactions

JF - Materials Transactions

SN - 0916-1821

IS - 3

ER -