Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder

K. Nogita, C. M. Gourlay, J. Read, T. Nishimura, S. Suenaga, A. K. Dahle

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds