Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu

Kosuke Takenaka, Manabu Takeshita, Kazunori Koga, Masaharu Shiratani, Yukio Watanabe

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

This chapter discusses the effects of sputtering due to ion irradiation on plasma anisotropic CVD of copper (Cu). The effects are studied using silicon (Si) substrates with trenches. Cu metallization contributed to scaling down of ultra large scale integration (ULSI), because Cu has a lower resistivity and better electro-migration resistance than aluminum. This chapter describes experimental results regarding deposition and sputtering rates at top, bottom surfaces, and sidewall of trenches. The chapter also discusses the effects of ion irradiation on plasma anisotropic CVD with the accent on roles of sputtering. Sputtering rates on the top and bottom surfaces decrease with increasing R from 0% to 66% and are nearly constant for R = 66-100%. The rate on the top surface is higher than that on the bottom surface. With decreasing the trench width, the deposition rate on the bottom surface increases, while the sputtering rate decreases.

Original languageEnglish
Title of host publicationNovel Materials Processing by Advanced Electromagnetic Energy Sources
PublisherElsevier
Pages75-78
Number of pages4
ISBN (Print)9780080445045
DOIs
Publication statusPublished - Dec 1 2005

Fingerprint

Ion bombardment
Sputtering
Chemical vapor deposition
Plasmas
ULSI circuits
Electromigration
Metallizing
Deposition rates
Copper
Aluminum
Silicon
Substrates

All Science Journal Classification (ASJC) codes

  • Energy(all)

Cite this

Takenaka, K., Takeshita, M., Koga, K., Shiratani, M., & Watanabe, Y. (2005). Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu. In Novel Materials Processing by Advanced Electromagnetic Energy Sources (pp. 75-78). Elsevier. https://doi.org/10.1016/B978-008044504-5/50015-5

Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu. / Takenaka, Kosuke; Takeshita, Manabu; Koga, Kazunori; Shiratani, Masaharu; Watanabe, Yukio.

Novel Materials Processing by Advanced Electromagnetic Energy Sources. Elsevier, 2005. p. 75-78.

Research output: Chapter in Book/Report/Conference proceedingChapter

Takenaka, K, Takeshita, M, Koga, K, Shiratani, M & Watanabe, Y 2005, Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu. in Novel Materials Processing by Advanced Electromagnetic Energy Sources. Elsevier, pp. 75-78. https://doi.org/10.1016/B978-008044504-5/50015-5
Takenaka K, Takeshita M, Koga K, Shiratani M, Watanabe Y. Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu. In Novel Materials Processing by Advanced Electromagnetic Energy Sources. Elsevier. 2005. p. 75-78 https://doi.org/10.1016/B978-008044504-5/50015-5
Takenaka, Kosuke ; Takeshita, Manabu ; Koga, Kazunori ; Shiratani, Masaharu ; Watanabe, Yukio. / Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu. Novel Materials Processing by Advanced Electromagnetic Energy Sources. Elsevier, 2005. pp. 75-78
@inbook{8501e4bfd54745a7b9a22153ddf77f4a,
title = "Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu",
abstract = "This chapter discusses the effects of sputtering due to ion irradiation on plasma anisotropic CVD of copper (Cu). The effects are studied using silicon (Si) substrates with trenches. Cu metallization contributed to scaling down of ultra large scale integration (ULSI), because Cu has a lower resistivity and better electro-migration resistance than aluminum. This chapter describes experimental results regarding deposition and sputtering rates at top, bottom surfaces, and sidewall of trenches. The chapter also discusses the effects of ion irradiation on plasma anisotropic CVD with the accent on roles of sputtering. Sputtering rates on the top and bottom surfaces decrease with increasing R from 0{\%} to 66{\%} and are nearly constant for R = 66-100{\%}. The rate on the top surface is higher than that on the bottom surface. With decreasing the trench width, the deposition rate on the bottom surface increases, while the sputtering rate decreases.",
author = "Kosuke Takenaka and Manabu Takeshita and Kazunori Koga and Masaharu Shiratani and Yukio Watanabe",
year = "2005",
month = "12",
day = "1",
doi = "10.1016/B978-008044504-5/50015-5",
language = "English",
isbn = "9780080445045",
pages = "75--78",
booktitle = "Novel Materials Processing by Advanced Electromagnetic Energy Sources",
publisher = "Elsevier",
address = "Netherlands",

}

TY - CHAP

T1 - Effects of spruttering due to ion irradiation on plasma anisotropic CVD of Cu

AU - Takenaka, Kosuke

AU - Takeshita, Manabu

AU - Koga, Kazunori

AU - Shiratani, Masaharu

AU - Watanabe, Yukio

PY - 2005/12/1

Y1 - 2005/12/1

N2 - This chapter discusses the effects of sputtering due to ion irradiation on plasma anisotropic CVD of copper (Cu). The effects are studied using silicon (Si) substrates with trenches. Cu metallization contributed to scaling down of ultra large scale integration (ULSI), because Cu has a lower resistivity and better electro-migration resistance than aluminum. This chapter describes experimental results regarding deposition and sputtering rates at top, bottom surfaces, and sidewall of trenches. The chapter also discusses the effects of ion irradiation on plasma anisotropic CVD with the accent on roles of sputtering. Sputtering rates on the top and bottom surfaces decrease with increasing R from 0% to 66% and are nearly constant for R = 66-100%. The rate on the top surface is higher than that on the bottom surface. With decreasing the trench width, the deposition rate on the bottom surface increases, while the sputtering rate decreases.

AB - This chapter discusses the effects of sputtering due to ion irradiation on plasma anisotropic CVD of copper (Cu). The effects are studied using silicon (Si) substrates with trenches. Cu metallization contributed to scaling down of ultra large scale integration (ULSI), because Cu has a lower resistivity and better electro-migration resistance than aluminum. This chapter describes experimental results regarding deposition and sputtering rates at top, bottom surfaces, and sidewall of trenches. The chapter also discusses the effects of ion irradiation on plasma anisotropic CVD with the accent on roles of sputtering. Sputtering rates on the top and bottom surfaces decrease with increasing R from 0% to 66% and are nearly constant for R = 66-100%. The rate on the top surface is higher than that on the bottom surface. With decreasing the trench width, the deposition rate on the bottom surface increases, while the sputtering rate decreases.

UR - http://www.scopus.com/inward/record.url?scp=84884440120&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84884440120&partnerID=8YFLogxK

U2 - 10.1016/B978-008044504-5/50015-5

DO - 10.1016/B978-008044504-5/50015-5

M3 - Chapter

AN - SCOPUS:84884440120

SN - 9780080445045

SP - 75

EP - 78

BT - Novel Materials Processing by Advanced Electromagnetic Energy Sources

PB - Elsevier

ER -