Effects of Sulfur and Phosphorus on Binder Decomposition Behavior of Nickel Powder

Fine Ni particles are utilized as internal electrode materials for multilayer ceramic capacitors. Despite extensive research, the effects of the surface properties (additional elements) remain unclear. To the best of our knowledge, the present study is the first to demonstrate the effects of the addition of sulfur (S) and phosphorus (P) on surface modification and binder decomposition during the production of fine Ni particles. Scanning electron microscopy, X-ray diffractometry, thermogravimetry-differential thermal analysis, hydrogen temperature-programmed reduction, temperature-programmed decomposition, and X-ray photoelectron spectroscopy were performed to analyze non-doped Ni, S-doped Ni and P-doped Ni powder. S existed as SO or NiS on the particle surface in the S-doped Ni powder, whereas P existed solely as PO on the particle surface in the P-doped Ni powder. When formed into a paste with these powders, the decomposition temperature of the binder is lower than that of the binder alone owing to the catalytic effect of the unmodified surface of Ni in non-doped Ni. However, the catalyst poisoning effect of S in S-doped Ni and the coating effect of PO in P-doped Ni suppressed the lowering of the binder decomposition temperature due to the catalysis of the Ni surface. The results of the present study are expected to inspire future research on the optimization of the manufacturing process of multilayer ceramic capacitors.