Electrical resistivity and morphology of Sn 1-x/Si x core-shell cluster network prepared by a plasma-gas-condensation cluster source

Yuichiro Kurokawa, Takehiko Hihara, Kenji Sumiyama

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Sn 1-x/Si x cluster assembled films have been prepared by a plasma-gas-condensation cluster beam deposition apparatus. Transmission electron microscope images indicate that individual clusters have core-shell morphology, where Sn cores are covered by Si shells. Temperature dependence of electrical resistivity exhibits a metallic behavior and a superconducting transition at low temperature for 0 < × < 0.20, while a semiconductor-type behavior and no superconductivity down to 2K for x > 0.29. These results indicate that the cluster network and/or core-shell morphology Sn 1-x/Si x cluster assembled films changes with x.

Original languageEnglish
Pages (from-to)1929-1932
Number of pages4
JournalMaterials Transactions
Volume53
Issue number11
DOIs
Publication statusPublished - 2012
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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