Electrodeposition of metallic tungsten films in ZnCl2-NaCl-KCl-KF-WO3 melt at 250 °C

Hironori Nakajima, Toshiyuki Nohira, Rika Hagiwara, Koji Nitta, Shinji Inazawa, Kazunori Okada

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

WO3 hardly dissolved in ZnCl2-NaCl-KCl (0.60:0.20:0.20, in mole fraction) melt at 250 °C. The solubility of WO3 increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 μm after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt.

Original languageEnglish
Pages (from-to)24-27
Number of pages4
JournalElectrochimica Acta
Volume53
Issue number1
DOIs
Publication statusPublished - Nov 20 2007
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Electrochemistry

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