TY - JOUR
T1 - Electrohydrodynamic flow in optoelectrostatic micropump
T2 - Experiment versus numerical simulation
AU - Adamiak, Kazimierz
AU - Mizuno, Akira
AU - Nakano, Michichiko
N1 - Funding Information:
MSDAD-08-17, presented at the 2007 Industry Applications Society Annual Meeting, New Orleans, LA, September 23–27, and approved for publication in the IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS by the Electrostatic Processes Committee of the IEEE Industry Applications Society. Manuscript submitted for review October 31, 2007 and released for publication June 7, 2008. Current version published March 18, 2009. This work was supported in part by the Natural Sciences and Engineering Research Council (NSERC) of Canada.
PY - 2009
Y1 - 2009
N2 - This paper deals with optoelectrostatic pumping of conductive liquids in microchannels. In this technique, the fluid is heated by laser irradiation and exposed to an external ac electric field. If the fluid permittivity and conductivity vary with temperature, the electric body force is generated, and pumping effect can be achieved. A numerical model of this phenomenon is presented, and it is based on the finite-element analysis of the electric, thermal, and flow fields. The numerical predictions are compared with the experimental data, with a reasonable qualitative agreement.
AB - This paper deals with optoelectrostatic pumping of conductive liquids in microchannels. In this technique, the fluid is heated by laser irradiation and exposed to an external ac electric field. If the fluid permittivity and conductivity vary with temperature, the electric body force is generated, and pumping effect can be achieved. A numerical model of this phenomenon is presented, and it is based on the finite-element analysis of the electric, thermal, and flow fields. The numerical predictions are compared with the experimental data, with a reasonable qualitative agreement.
UR - http://www.scopus.com/inward/record.url?scp=64049087023&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=64049087023&partnerID=8YFLogxK
U2 - 10.1109/TIA.2009.2013555
DO - 10.1109/TIA.2009.2013555
M3 - Article
AN - SCOPUS:64049087023
SN - 0093-9994
VL - 45
SP - 615
EP - 622
JO - IEEE Transactions on Applications and Industry
JF - IEEE Transactions on Applications and Industry
IS - 2
ER -