Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package

Akihiro Ikeda, Atsushi Sakamoto, Reiji Hattori, Yukinori Kuroki

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Fingerprint Dive into the research topics of 'Electroless Ni-B plating on SiO<sub>2</sub> with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy