Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness

H. Honda, Hiroshi Takamatsu, J. J. Wei

Research output: Contribution to journalArticle

187 Citations (Scopus)

Abstract

Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60 μm 3 (width ×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip (10×10×0.5 mm 3) by use of microelectronic fabrication techniques. Experiments were conducted at the liquid sub-coolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid sub-cooling.

Original languageEnglish
Pages (from-to)383-390
Number of pages8
JournalJournal of Heat Transfer
Volume124
Issue number2
DOIs
Publication statusPublished - Apr 1 2002

Fingerprint

fins
Silicon
boiling
Boiling liquids
roughness
Surface roughness
chips
silicon
Heat flux
Heat transfer
heat transfer
heat flux
dissolved gases
Gases
Cooling
Nucleate boiling
Fins (heat exchange)
Liquids
fluorocarbon 72
Microelectronics

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness. / Honda, H.; Takamatsu, Hiroshi; Wei, J. J.

In: Journal of Heat Transfer, Vol. 124, No. 2, 01.04.2002, p. 383-390.

Research output: Contribution to journalArticle

@article{1170dda2e76f4d51b89974363ac79f23,
title = "Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness",
abstract = "Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60 μm 3 (width ×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip (10×10×0.5 mm 3) by use of microelectronic fabrication techniques. Experiments were conducted at the liquid sub-coolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid sub-cooling.",
author = "H. Honda and Hiroshi Takamatsu and Wei, {J. J.}",
year = "2002",
month = "4",
day = "1",
doi = "10.1115/1.1447937",
language = "English",
volume = "124",
pages = "383--390",
journal = "Journal of Heat Transfer",
issn = "0022-1481",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "2",

}

TY - JOUR

T1 - Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness

AU - Honda, H.

AU - Takamatsu, Hiroshi

AU - Wei, J. J.

PY - 2002/4/1

Y1 - 2002/4/1

N2 - Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60 μm 3 (width ×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip (10×10×0.5 mm 3) by use of microelectronic fabrication techniques. Experiments were conducted at the liquid sub-coolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid sub-cooling.

AB - Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60 μm 3 (width ×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip (10×10×0.5 mm 3) by use of microelectronic fabrication techniques. Experiments were conducted at the liquid sub-coolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid sub-cooling.

UR - http://www.scopus.com/inward/record.url?scp=0036536682&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036536682&partnerID=8YFLogxK

U2 - 10.1115/1.1447937

DO - 10.1115/1.1447937

M3 - Article

AN - SCOPUS:0036536682

VL - 124

SP - 383

EP - 390

JO - Journal of Heat Transfer

JF - Journal of Heat Transfer

SN - 0022-1481

IS - 2

ER -