Enhanced wettability of cubic boron nitride films by plasma treatment

Jason Hsiao Chun Yang, Shinji Kawakami, Kungen Teii, Seiichiro Matsumoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The wettability of hydrogen plasma-treated cubic boron nitride (cBN) films is studied. The films are prepared on Si substrates by inductively coupled plasma (ICP)-enhanced chemical vapor deposition, and further treated by pure hydrogen ICP and microwave plasma (MWP) separately. The surface roughness of the films and the cBN content in the films show only minor changes after the plasma treatment in any treatment condition. The contact angle of polar water and apolar 1-bromonaphthalene is reduced greatly with the ICP post-treatment, while it is reduced only moderately with the MWP post-treatment. The highly hydrophilic behavior with very low contact angles is attributed to a marked increase in the polar component of the apparent surface free energy up to 34 mJ/m2.

Original languageEnglish
Title of host publicationTHERMEC 2013
EditorsB. Mishra, Mihail. Ionescu, T. Chandra
PublisherTrans Tech Publications Ltd
Pages2051-2055
Number of pages5
ISBN (Print)9783038350736
DOIs
Publication statusPublished - Jan 1 2014
Event8th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC 2013 - Las Vegas, NV, United States
Duration: Dec 2 2013Dec 6 2013

Publication series

NameMaterials Science Forum
Volume783-786
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other8th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC 2013
CountryUnited States
CityLas Vegas, NV
Period12/2/1312/6/13

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Yang, J. H. C., Kawakami, S., Teii, K., & Matsumoto, S. (2014). Enhanced wettability of cubic boron nitride films by plasma treatment. In B. Mishra, M. Ionescu, & T. Chandra (Eds.), THERMEC 2013 (pp. 2051-2055). (Materials Science Forum; Vol. 783-786). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/msf.783-786.2051