Enhancement of cooling rate during the rapid quencing of a thin wire by ultrasonic vibration

Hiroshi Takamatsu, Hikaru Yamashiro, Hiroshi Honda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication3rd KSME/JSME Thermal Engineering Conference
Pages339-344
Number of pages6
VolumeVol.3
Publication statusPublished - Oct 1996

Cite this

Takamatsu, H., Yamashiro, H., & Honda, H. (1996). Enhancement of cooling rate during the rapid quencing of a thin wire by ultrasonic vibration. In 3rd KSME/JSME Thermal Engineering Conference (Vol. Vol.3, pp. 339-344)

Enhancement of cooling rate during the rapid quencing of a thin wire by ultrasonic vibration. / Takamatsu, Hiroshi; Yamashiro, Hikaru; Honda, Hiroshi.

3rd KSME/JSME Thermal Engineering Conference. Vol. Vol.3 1996. p. 339-344.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takamatsu, H, Yamashiro, H & Honda, H 1996, Enhancement of cooling rate during the rapid quencing of a thin wire by ultrasonic vibration. in 3rd KSME/JSME Thermal Engineering Conference. vol. Vol.3, pp. 339-344.
Takamatsu H, Yamashiro H, Honda H. Enhancement of cooling rate during the rapid quencing of a thin wire by ultrasonic vibration. In 3rd KSME/JSME Thermal Engineering Conference. Vol. Vol.3. 1996. p. 339-344
Takamatsu, Hiroshi ; Yamashiro, Hikaru ; Honda, Hiroshi. / Enhancement of cooling rate during the rapid quencing of a thin wire by ultrasonic vibration. 3rd KSME/JSME Thermal Engineering Conference. Vol. Vol.3 1996. pp. 339-344
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