Abstract
Pure Cu (99.99%) is processed by equal-channel angular pressing (ECAP) and by high-pressure torsion (HPT). The electrical resistivity as well as the microhardness increases with an increase in the equivalent strain at an early stage of straining, but saturates to a steady state at the equivalent strains more than ̃20. At the steady state, the samples processed by ECAP and HPT show a significant increase in the hardness (̃270%) but little decrease in the electrical conductivity (̃12%) when compared to the annealed state. Transmission electron microscopy confirms that the microstructure does not change at the saturated level with further straining. Evolutions of hardness, electrical conductivity and microstructures are also investigated after post-HPT annealing.
| Original language | English |
|---|---|
| Pages (from-to) | 123-127 |
| Number of pages | 5 |
| Journal | Materials Transactions |
| Volume | 53 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Mar 21 2012 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
Equal-channel angular pressing and high-pressure torsion of pure copper : Evolution of electrical conductivity and hardness with strain. / Edalati, Kaveh; Imamura, Kazutaka; Kiss, Takanobu; Horita, Zenji.
In: Materials Transactions, Vol. 53, No. 1, 21.03.2012, p. 123-127.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Equal-channel angular pressing and high-pressure torsion of pure copper
T2 - Evolution of electrical conductivity and hardness with strain
AU - Edalati, Kaveh
AU - Imamura, Kazutaka
AU - Kiss, Takanobu
AU - Horita, Zenji
PY - 2012/3/21
Y1 - 2012/3/21
N2 - Pure Cu (99.99%) is processed by equal-channel angular pressing (ECAP) and by high-pressure torsion (HPT). The electrical resistivity as well as the microhardness increases with an increase in the equivalent strain at an early stage of straining, but saturates to a steady state at the equivalent strains more than ̃20. At the steady state, the samples processed by ECAP and HPT show a significant increase in the hardness (̃270%) but little decrease in the electrical conductivity (̃12%) when compared to the annealed state. Transmission electron microscopy confirms that the microstructure does not change at the saturated level with further straining. Evolutions of hardness, electrical conductivity and microstructures are also investigated after post-HPT annealing.
AB - Pure Cu (99.99%) is processed by equal-channel angular pressing (ECAP) and by high-pressure torsion (HPT). The electrical resistivity as well as the microhardness increases with an increase in the equivalent strain at an early stage of straining, but saturates to a steady state at the equivalent strains more than ̃20. At the steady state, the samples processed by ECAP and HPT show a significant increase in the hardness (̃270%) but little decrease in the electrical conductivity (̃12%) when compared to the annealed state. Transmission electron microscopy confirms that the microstructure does not change at the saturated level with further straining. Evolutions of hardness, electrical conductivity and microstructures are also investigated after post-HPT annealing.
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UR - http://www.scopus.com/inward/citedby.url?scp=84858310945&partnerID=8YFLogxK
U2 - 10.2320/matertrans.MD201109
DO - 10.2320/matertrans.MD201109
M3 - Article
AN - SCOPUS:84858310945
VL - 53
SP - 123
EP - 127
JO - Materials Transactions
JF - Materials Transactions
SN - 0916-1821
IS - 1
ER -