Erosion behavior of carbon deposition layers formed by hydrogen plasma sputtering

T. Okamura, Kazunari Katayama, K. Imaoka, Y. Uchida, M. Nishikawa, Satoshi Fukada

Research output: Contribution to journalArticle

Abstract

The erosion of carbon deposition layers by oxygen exposure and the desorpstion of hydrogen retained in the layers were investigated experimentally. Carbon deposition layers were formed by a sputtering method using hydrogen RF plasma. The layers were exposed to an argon gas with oxygen of 1013 Pa in the temperature range of 200 - 400°C. The erosion reaction progressed quickly within 10 minutes and then decelerated rapidly. The measurement of the outlet concentration revealed that most of the layer was eroded not as carbon monoxide and carbon dioxide but as soot. Additionally, it was estimated that the soot was released from the carbon deposition layer with a large amount of hydrogen.

Original languageEnglish
Pages (from-to)645-648
Number of pages4
JournalFusion Science and Technology
Volume52
Issue number3
DOIs
Publication statusPublished - Jan 1 2007

Fingerprint

hydrogen plasma
erosion
Soot
Sputtering
Hydrogen
Erosion
Carbon
sputtering
Plasmas
carbon
Oxygen
Argon
soot
Carbon Monoxide
Carbon Dioxide
Carbon monoxide
Carbon dioxide
hydrogen
Gases
oxygen

All Science Journal Classification (ASJC) codes

  • Civil and Structural Engineering
  • Nuclear and High Energy Physics
  • Nuclear Energy and Engineering
  • Materials Science(all)
  • Mechanical Engineering

Cite this

Erosion behavior of carbon deposition layers formed by hydrogen plasma sputtering. / Okamura, T.; Katayama, Kazunari; Imaoka, K.; Uchida, Y.; Nishikawa, M.; Fukada, Satoshi.

In: Fusion Science and Technology, Vol. 52, No. 3, 01.01.2007, p. 645-648.

Research output: Contribution to journalArticle

Okamura, T. ; Katayama, Kazunari ; Imaoka, K. ; Uchida, Y. ; Nishikawa, M. ; Fukada, Satoshi. / Erosion behavior of carbon deposition layers formed by hydrogen plasma sputtering. In: Fusion Science and Technology. 2007 ; Vol. 52, No. 3. pp. 645-648.
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