TY - GEN
T1 - Establishment of Treatment of Retinal Vein Occlusion by Physical Stimuli of Electrically-Induced Bubbles
AU - Sumimoto, Mei
AU - Matsumura, Daisuke
AU - Ichikawa, Keita
AU - Miwa, Keiko
AU - Oh, Hideyasu
AU - Moriizumi, Yasuhiro
AU - Yamanishi, Yoko
PY - 2019/6
Y1 - 2019/6
N2 - For this study, a novel treatment of retinal vein occlusion by physical stimuli of electrically-induced bubbles was proposed. Our device can apply local and minimally-invasive physical stimuli to retinal minute blood vessels with a diameter of about 100 μm, utilizing the impact pressure when microbubbles collapse. Furthermore, it is possible to sense the approach of the device to the target by measuring the capacitance. Vascular vessels of chick embryos whose size is similar to that of the retinal vein, and retinal veins of pig were used as in-vitro and in-vivo model respectively. Also, micro-vascular occlusion models were successfully operated and local physical stimuli was applied to the blood clot which is artificially produced. The 60% of reperfusion against the initial amount was confirmed by blood flow measurement for both in vitro and in vivo environment.
AB - For this study, a novel treatment of retinal vein occlusion by physical stimuli of electrically-induced bubbles was proposed. Our device can apply local and minimally-invasive physical stimuli to retinal minute blood vessels with a diameter of about 100 μm, utilizing the impact pressure when microbubbles collapse. Furthermore, it is possible to sense the approach of the device to the target by measuring the capacitance. Vascular vessels of chick embryos whose size is similar to that of the retinal vein, and retinal veins of pig were used as in-vitro and in-vivo model respectively. Also, micro-vascular occlusion models were successfully operated and local physical stimuli was applied to the blood clot which is artificially produced. The 60% of reperfusion against the initial amount was confirmed by blood flow measurement for both in vitro and in vivo environment.
UR - http://www.scopus.com/inward/record.url?scp=85071905132&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071905132&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2019.8808464
DO - 10.1109/TRANSDUCERS.2019.8808464
M3 - Conference contribution
T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
SP - 809
EP - 812
BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Y2 - 23 June 2019 through 27 June 2019
ER -