Evaluation of durability of thermoelectric properties for Zn 4Sb3 compounds

Takeshi Souma, Michitaka Ohtaki

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    Durability of the Zn4Sb3 compounds was evaluated in term of their thermoelectric properties by applying repeated heat cycles to the vacuum-casted and hot-pressed samples. The power factor of both samples decreased by applying 20 cycle heat load. The major reason of the deterioration was formation of the ZnCd compounds due to evaporating Zn from the Zn 4Sb3 compounds. The degree of the deterioration of the thermoelectric performance and a solution to enhanced durability of the compounds are discussed.

    Original languageEnglish
    Title of host publicationProceedings - ICT'05
    Subtitle of host publication24th International Conference on Thermoelectrics
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages411-414
    Number of pages4
    ISBN (Print)0780395522, 9780780395527
    DOIs
    Publication statusPublished - 2005
    EventICT'05: 24th International Conference on Thermoelectrics - Clemson, SC, United States
    Duration: Jun 19 2005Jun 23 2005

    Publication series

    NameInternational Conference on Thermoelectrics, ICT, Proceedings
    Volume2005

    Other

    OtherICT'05: 24th International Conference on Thermoelectrics
    CountryUnited States
    CityClemson, SC
    Period6/19/056/23/05

    All Science Journal Classification (ASJC) codes

    • Engineering(all)

    Fingerprint Dive into the research topics of 'Evaluation of durability of thermoelectric properties for Zn <sub>4</sub>Sb<sub>3</sub> compounds'. Together they form a unique fingerprint.

    Cite this