Evaluation of durability of thermoelectric properties for Zn 4Sb3 compounds

Takeshi Souma; Michitaka Ohtaki

doi:10.1109/ICT.2005.1519974

Evaluation of durability of thermoelectric properties for Zn ₄Sb₃ compounds

Takeshi Souma, Michitaka Ohtaki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Durability of the Zn₄Sb₃ compounds was evaluated in term of their thermoelectric properties by applying repeated heat cycles to the vacuum-casted and hot-pressed samples. The power factor of both samples decreased by applying 20 cycle heat load. The major reason of the deterioration was formation of the ZnCd compounds due to evaporating Zn from the Zn ₄Sb₃ compounds. The degree of the deterioration of the thermoelectric performance and a solution to enhanced durability of the compounds are discussed.

Original language	English
Title of host publication	Proceedings - ICT'05
Subtitle of host publication	24th International Conference on Thermoelectrics
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	411-414
Number of pages	4
ISBN (Print)	0780395522, 9780780395527
DOIs	https://doi.org/10.1109/ICT.2005.1519974
Publication status	Published - 2005
Event	ICT'05: 24th International Conference on Thermoelectrics - Clemson, SC, United States Duration: Jun 19 2005 → Jun 23 2005

Publication series

Name	International Conference on Thermoelectrics, ICT, Proceedings
Volume	2005

Other

Other	ICT'05: 24th International Conference on Thermoelectrics
Country/Territory	United States
City	Clemson, SC
Period	6/19/05 → 6/23/05

All Science Journal Classification (ASJC) codes

Engineering(all)

Access to Document

10.1109/ICT.2005.1519974

Cite this

Souma, T., & Ohtaki, M. (2005). Evaluation of durability of thermoelectric properties for Zn ₄Sb₃ compounds. In Proceedings - ICT'05: 24th International Conference on Thermoelectrics (pp. 411-414). [1519974] (International Conference on Thermoelectrics, ICT, Proceedings; Vol. 2005). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICT.2005.1519974

Evaluation of durability of thermoelectric properties for Zn ₄Sb₃ compounds. / Souma, Takeshi; Ohtaki, Michitaka.

Proceedings - ICT'05: 24th International Conference on Thermoelectrics. Institute of Electrical and Electronics Engineers Inc., 2005. p. 411-414 1519974 (International Conference on Thermoelectrics, ICT, Proceedings; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Souma, T & Ohtaki, M 2005, Evaluation of durability of thermoelectric properties for Zn ₄Sb₃ compounds. in Proceedings - ICT'05: 24th International Conference on Thermoelectrics., 1519974, International Conference on Thermoelectrics, ICT, Proceedings, vol. 2005, Institute of Electrical and Electronics Engineers Inc., pp. 411-414, ICT'05: 24th International Conference on Thermoelectrics, Clemson, SC, United States, 6/19/05. https://doi.org/10.1109/ICT.2005.1519974

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