Evalution of drop strength due to thermal degradation for BGA-IC package

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

Research output: Contribution to journalReview article

Abstract

The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.

Original languageEnglish
Pages (from-to)186-191
Number of pages6
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume72
Issue number2
Publication statusPublished - Jan 1 2006

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Soldering alloys
Pyrolysis
Impact strength
Copper compounds
Intermetallics
Aging of materials

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Evalution of drop strength due to thermal degradation for BGA-IC package. / Kim, Young Bae; Noguchi, Hiroshi; Amagai, Masazumi.

In: Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, Vol. 72, No. 2, 01.01.2006, p. 186-191.

Research output: Contribution to journalReview article

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