Evalution of drop strength due to thermal degradation for BGA-IC package

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

Research output: Contribution to journalReview articlepeer-review

Fingerprint

Dive into the research topics of 'Evalution of drop strength due to thermal degradation for BGA-IC package'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science