Abstract
Profiles of local evaporation rate from a liquid surface formed in a cylindrical hole are numerically estimated using the finite element method. The droplet is so small that the evaporation can be considered as a steady-state process and the vapor concentration distribution above the droplet satisfies the diffusion equation. Generally, the local evaporation rate of a droplet is small at the center, but becomes stronger near the contact line on the flat substrate. In a cylindrical hole, the local evaporation rate near the contact line is prevented by the vertical sidewall especially for a high sidewall. The effect of bank height and the contact angle on the local evaporation rates and total evaporation rate are also discussed.
Original language | English |
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Pages (from-to) | 49-52 |
Number of pages | 4 |
Journal | JOURNAL OF CHEMICAL ENGINEERING OF JAPAN |
Volume | 51 |
Issue number | 1 |
DOIs | |
Publication status | Published - Jan 1 2018 |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Chemical Engineering(all)