Examination of residual stress measurement in electronic packages using phase-shifted sampling moiré method and X-ray images

Masaaki Koganemaru, Masakazu Uchino, Akihiro Ikeda, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper examines a novel approach to measure residual stresses in an electronic package. The presented method applies a phase-shifted sampling moiré method to X-ray images of the test chip (Si) in the electronic package. In this study, the test chip including an Au bump grid are made by general semiconductor processes for forming Au bumps on Si chip, and X-ray images of the test chip are taken before and after packaging (resin-molding). Then the phase difference of the sampling moiré fringe patterns before and after packaging can be obtained from the X-ray images of the test chip before and after packaging. The phase difference corresponds to the deformation of the test chip. The results of this examination indicate that the presented method is possible to be used for measuring residual stresses in electronic packages.

Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479940264
DOIs
Publication statusPublished - Nov 18 2014
Event5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland
Duration: Sep 16 2014Sep 18 2014

Publication series

NameProceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014

Other

Other5th Electronics System-Integration Technology Conference, ESTC 2014
CountryFinland
CityHelsinki
Period9/16/149/18/14

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All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Koganemaru, M., Uchino, M., Ikeda, A., & Asano, T. (2014). Examination of residual stress measurement in electronic packages using phase-shifted sampling moiré method and X-ray images. In Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 [6962827] (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2014.6962827