Experimental study of electron-phonon coupling factor of copper thin film

Wei Gang Ma, Haidong Wang, Xing Zhang, Zeng Yuan Guo

Research output: Contribution to journalArticle

Abstract

Metallic thin wires are widely used as interconnectors in the ultra-miniature and highly-integrated systems and expected to exhibit high heat conductance. While in the development of novel photoelectric material, the coupling between electrons and phonons should be reduced as much as possible. The electron-phonon coupling is dominant to energy exchange in metals and the interaction time is in the order of femto to picoseconds. In this paper, the electron-phonon coupling factor of a copper nanofilm with thickness 60 nm deposited on the silicon substrate is measured using the transient thermoreflectance technique. The measured coupling factor is (11~12)×1016 W/(m3K) and very closed to the theoretical value 14×1016 W/(m3K).

Original languageEnglish
Pages (from-to)499-502
Number of pages4
JournalKung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics
Volume31
Issue number3
Publication statusPublished - Mar 1 2010

Fingerprint

Copper
Thin films
copper
Electrons
thin films
electrons
photoelectric materials
Silicon
Phonons
Metals
Wire
phonons
energy transfer
wire
Substrates
heat
silicon
metals
interactions
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering

Cite this

Experimental study of electron-phonon coupling factor of copper thin film. / Ma, Wei Gang; Wang, Haidong; Zhang, Xing; Guo, Zeng Yuan.

In: Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics, Vol. 31, No. 3, 01.03.2010, p. 499-502.

Research output: Contribution to journalArticle

Ma, Wei Gang ; Wang, Haidong ; Zhang, Xing ; Guo, Zeng Yuan. / Experimental study of electron-phonon coupling factor of copper thin film. In: Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics. 2010 ; Vol. 31, No. 3. pp. 499-502.
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