Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

Shu Rong Tian, Hiroshi Takamatsu, Hiroshi Honda

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The heat transfer characteristics of a simulated immersion cooling module were studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with rectangular fins that were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip of the condenser, the fin spacing of the condenser, and the cooling water temperature on the boiling curve, are presented.

Original languageEnglish
Pages (from-to)497-508
Number of pages12
JournalHeat Transfer - Asian Research
Volume27
Issue number7
Publication statusPublished - Dec 1 1998

Fingerprint

Multichip modules
Facings
condensing
condensers
fins
Cooling water
Silicon
Boiling liquids
submerging
modules
Heat transfer
Cooling
cooling
Fluids
Substrates
chips
water temperature
boiling
Temperature
boxes

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Fluid Flow and Transfer Processes

Cite this

Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface. / Tian, Shu Rong; Takamatsu, Hiroshi; Honda, Hiroshi.

In: Heat Transfer - Asian Research, Vol. 27, No. 7, 01.12.1998, p. 497-508.

Research output: Contribution to journalArticle

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