The heat transfer characteristics of a simulated immersion cooling module were studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with rectangular fins that were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip of the condenser, the fin spacing of the condenser, and the cooling water temperature on the boiling curve, are presented.
|Number of pages||12|
|Journal||Heat Transfer - Asian Research|
|Publication status||Published - 1998|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Fluid Flow and Transfer Processes