Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

S. R. Tian, H. Takamatsu, H. Honda

Research output: Contribution to conferencePaperpeer-review

Abstract

Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.

Original languageEnglish
Pages206-211
Number of pages6
Publication statusPublished - 1996
EventProceedings of the 1996 4th International Symposium on Heat Transfer, ISHT - Beijing, China
Duration: Oct 7 1996Oct 11 1996

Other

OtherProceedings of the 1996 4th International Symposium on Heat Transfer, ISHT
CityBeijing, China
Period10/7/9610/11/96

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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