Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

S. R. Tian, Hiroshi Takamatsu, H. Honda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.

Original languageEnglish
Title of host publicationInternational Symposium on Heat Transfer
EditorsB. Wang
PublisherTsinghua Univ
Pages206-211
Number of pages6
Publication statusPublished - 1996
EventProceedings of the 1996 4th International Symposium on Heat Transfer, ISHT - Beijing, China
Duration: Oct 7 1996Oct 11 1996

Other

OtherProceedings of the 1996 4th International Symposium on Heat Transfer, ISHT
CityBeijing, China
Period10/7/9610/11/96

Fingerprint

Multichip modules
Cooling
Facings
Cooling water
Boiling liquids
Heat transfer
Silicon
Fluids
Substrates
Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Tian, S. R., Takamatsu, H., & Honda, H. (1996). Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface. In B. Wang (Ed.), International Symposium on Heat Transfer (pp. 206-211). Tsinghua Univ.

Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface. / Tian, S. R.; Takamatsu, Hiroshi; Honda, H.

International Symposium on Heat Transfer. ed. / B. Wang. Tsinghua Univ, 1996. p. 206-211.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tian, SR, Takamatsu, H & Honda, H 1996, Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface. in B Wang (ed.), International Symposium on Heat Transfer. Tsinghua Univ, pp. 206-211, Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT, Beijing, China, 10/7/96.
Tian SR, Takamatsu H, Honda H. Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface. In Wang B, editor, International Symposium on Heat Transfer. Tsinghua Univ. 1996. p. 206-211
Tian, S. R. ; Takamatsu, Hiroshi ; Honda, H. / Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface. International Symposium on Heat Transfer. editor / B. Wang. Tsinghua Univ, 1996. pp. 206-211
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