Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.
|Number of pages||6|
|Publication status||Published - 1996|
|Event||Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT - Beijing, China|
Duration: Oct 7 1996 → Oct 11 1996
|Other||Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT|
|Period||10/7/96 → 10/11/96|
All Science Journal Classification (ASJC) codes