Fabrication and evaluation of molding and bonding tools for Au micromirror formation

Ryutaro Nishimura, Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to fabricate Au micromirrors using a method of simultaneous molding and low-temperature Au-Au bonding, a fabrication method of molding and bonding tools using diamond blade dicing is investigated. Diamond blade dicing of synthetic quartz glass substrates produced smooth sidewall surfaces with root-mean-square roughness of 8 nm in the sample translation direction and that of 56 nm in the perpendicular to the translation direction. Using these fabricated tools, Au micromirrors were successfully formed at 150 °C.

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743034
DOIs
Publication statusPublished - Jun 13 2017
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: May 16 2017May 18 2017

Publication series

NameProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period5/16/175/18/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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  • Cite this

    Nishimura, R., Matsuoka, S., Higurashi, E., Suga, T., & Sawada, R. (2017). Fabrication and evaluation of molding and bonding tools for Au micromirror formation. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947480] (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947480