Fabrication and evaluation of molding and bonding tools for Au micromirror formation

Ryutaro Nishimura, Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to fabricate Au micromirrors using a method of simultaneous molding and low-temperature Au-Au bonding, a fabrication method of molding and bonding tools using diamond blade dicing is investigated. Diamond blade dicing of synthetic quartz glass substrates produced smooth sidewall surfaces with root-mean-square roughness of 8 nm in the sample translation direction and that of 56 nm in the perpendicular to the translation direction. Using these fabricated tools, Au micromirrors were successfully formed at 150 °C.

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743034
DOIs
Publication statusPublished - Jun 13 2017
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: May 16 2017May 18 2017

Publication series

NameProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period5/16/175/18/17

Fingerprint

Diamond
Molding
Diamonds
Fabrication
Quartz
Surface roughness
Glass
Substrates
Temperature
Direction compound

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Cite this

Nishimura, R., Matsuoka, S., Higurashi, E., Suga, T., & Sawada, R. (2017). Fabrication and evaluation of molding and bonding tools for Au micromirror formation. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947480] (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947480

Fabrication and evaluation of molding and bonding tools for Au micromirror formation. / Nishimura, Ryutaro; Matsuoka, Seiya; Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7947480 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nishimura, R, Matsuoka, S, Higurashi, E, Suga, T & Sawada, R 2017, Fabrication and evaluation of molding and bonding tools for Au micromirror formation. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947480, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Institute of Electrical and Electronics Engineers Inc., 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 5/16/17. https://doi.org/10.23919/LTB-3D.2017.7947480
Nishimura R, Matsuoka S, Higurashi E, Suga T, Sawada R. Fabrication and evaluation of molding and bonding tools for Au micromirror formation. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7947480. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). https://doi.org/10.23919/LTB-3D.2017.7947480
Nishimura, Ryutaro ; Matsuoka, Seiya ; Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi. / Fabrication and evaluation of molding and bonding tools for Au micromirror formation. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).
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