Fabrication of current-perpendicular-to-plane junctions based on Fe 3Si/FeSi2 multilayered films by lift-off

Y. Noda, K. Sakai, T. Sonoda, D. Tsumagari, K. Takeda, Tsuyoshi Yoshitake

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Current-perpendicular-to-plane (CPP) junctions comprising Fe 3Si/FeSi2 multilayers were prepared by a lift-off process combined with lithography techniques. The Fe3Si/FeSi2 multilayered films were grown on Si (111) substrates at room temperature by facing-targets direct-current sputtering. From the X-ray diffraction measurements, it was confirmed that the Fe3Si layers were epitaxially grown from the first layer on Si (111) up to the top layer across the FeSi2 layers with the same orientation relationship as that in the first layer. The CPP junctions, wherein ferromagnetic interlayer coupling across the FeSi2 spacer layers was induced, exhibited an obvious change in the electrical resistance for the current injection, which might be due to currentinduced magnetization switching.

    Original languageEnglish
    Title of host publicationMagnetic Materials, Processes, and Devices 12
    Pages223-228
    Number of pages6
    Edition10
    DOIs
    Publication statusPublished - Dec 1 2012
    Event12th International Symposium on Magnetic Materials, Processes and Devices - PRiME 2012 - Honolulu, HI, United States
    Duration: Oct 8 2012Oct 10 2012

    Publication series

    NameECS Transactions
    Number10
    Volume50
    ISSN (Print)1938-5862
    ISSN (Electronic)1938-6737

    Other

    Other12th International Symposium on Magnetic Materials, Processes and Devices - PRiME 2012
    CountryUnited States
    CityHonolulu, HI
    Period10/8/1210/10/12

    All Science Journal Classification (ASJC) codes

    • Engineering(all)

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  • Cite this

    Noda, Y., Sakai, K., Sonoda, T., Tsumagari, D., Takeda, K., & Yoshitake, T. (2012). Fabrication of current-perpendicular-to-plane junctions based on Fe 3Si/FeSi2 multilayered films by lift-off. In Magnetic Materials, Processes, and Devices 12 (10 ed., pp. 223-228). (ECS Transactions; Vol. 50, No. 10). https://doi.org/10.1149/05010.0223ecst