Abstract
A micro IC probe, which is a small, elastic electrical contact, has been developed to improve LSI testing and reduce its cost. No larger than 300×80 μm, it is fabricated with a pitch of 100 μm by micromachining techniques. Its contact resistance is less than 0.5 Ω, satisfying the requirements for conventional probes, and its deflection is 2 to 8 μm to accommodate height differences among LSI pads while maintaining contact.
| Original language | English |
|---|---|
| Pages (from-to) | 126-131 |
| Number of pages | 6 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 80 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - Mar 10 2000 |
| Externally published | Yes |
| Event | 12th IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-99) - Orlando, FL, USA Duration: Jan 17 1999 → Jan 21 1999 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering
Cite this
Fabrication of micro IC probe for LSI testing. / Takahiro, Ito; Sawada, Renshi; Higurashi, Eiji.
In: Sensors and Actuators, A: Physical, Vol. 80, No. 2, 10.03.2000, p. 126-131.Research output: Contribution to journal › Conference article
}
TY - JOUR
T1 - Fabrication of micro IC probe for LSI testing
AU - Takahiro, Ito
AU - Sawada, Renshi
AU - Higurashi, Eiji
PY - 2000/3/10
Y1 - 2000/3/10
N2 - A micro IC probe, which is a small, elastic electrical contact, has been developed to improve LSI testing and reduce its cost. No larger than 300×80 μm, it is fabricated with a pitch of 100 μm by micromachining techniques. Its contact resistance is less than 0.5 Ω, satisfying the requirements for conventional probes, and its deflection is 2 to 8 μm to accommodate height differences among LSI pads while maintaining contact.
AB - A micro IC probe, which is a small, elastic electrical contact, has been developed to improve LSI testing and reduce its cost. No larger than 300×80 μm, it is fabricated with a pitch of 100 μm by micromachining techniques. Its contact resistance is less than 0.5 Ω, satisfying the requirements for conventional probes, and its deflection is 2 to 8 μm to accommodate height differences among LSI pads while maintaining contact.
UR - http://www.scopus.com/inward/record.url?scp=0033880127&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0033880127&partnerID=8YFLogxK
U2 - 10.1016/S0924-4247(99)00257-5
DO - 10.1016/S0924-4247(99)00257-5
M3 - Conference article
AN - SCOPUS:0033880127
VL - 80
SP - 126
EP - 131
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
IS - 2
ER -