Fabrication of nanoline arrays of noble metals by electroless plating and selective etching process

Kentaro Miyoshi, Shigenori Fujikawa, Toyoki Kunitake

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The fabrication of one-dimensional metallic nanostructures has attracted much attention because they can be utilized to components of nanoelectronic devices. In this paper, we report the fabrication of nanoline array composed of Cu, Au, Cu/Ag by the electroless plating and etching technique. In all case, the metallic layers uniformly coated the template surface with sub-100 nm thickness. Bilayer structure of Cu and Ag layer was also formed by the sequential plating of Ag and Cu. Top layer and the template were selectively removed by dry etching process with Ar, H2 and O2. Nanoline array of Cu, Au, and Ag/Cu were finally formed on a Si wafer. The width of the metallic line is close to the thickness of the original coating layer. Our process provides the rapid and cost-efficient nanofabrication of metal nanoline.

Original languageEnglish
Pages (from-to)238-243
Number of pages6
JournalColloids and Surfaces A: Physicochemical and Engineering Aspects
Volume321
Issue number1-3
DOIs
Publication statusPublished - May 15 2008
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Surfaces and Interfaces
  • Physical and Theoretical Chemistry
  • Colloid and Surface Chemistry

Fingerprint Dive into the research topics of 'Fabrication of nanoline arrays of noble metals by electroless plating and selective etching process'. Together they form a unique fingerprint.

Cite this