Fabrication of VGA size near-infrared image sensor using room-temperature flip-chip bonding technology

Takanori Shuto, Keiichiro Iwanabe, Mutsuo Ogura, Katsuhiko Nishida, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared image sensor. The image sensor is fabricated using the flip-chip bonding of an InGaAs/InP photodiode-array chip and a Si CMOS readout IC chip. The pixel pitch is 15 μm to compose VGA class (640 × 512 pixels) resolution. High-quality imaging of a heated object and blood vessels of human hand is demonstrated.

Original languageEnglish
Title of host publicationProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages536-539
Number of pages4
ISBN (Electronic)9781479969944
DOIs
Publication statusPublished - Jan 30 2014
Event2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore
Duration: Dec 3 2014Dec 5 2014

Publication series

NameProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

Other

Other2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
CountrySingapore
CitySingapore
Period12/3/1412/5/14

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Shuto, T., Iwanabe, K., Ogura, M., Nishida, K., & Asano, T. (2014). Fabrication of VGA size near-infrared image sensor using room-temperature flip-chip bonding technology. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 (pp. 536-539). [7028408] (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2014.7028408