Fatigue characteristics of solder joints in BGA-IC package due to vibration (1st report, comparison of package of Pb-free solder ball with that of Pb solder ball under a transverse vibration)

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, a new method was proposed for evaluating the high-cycle fatigue strength of BGA (Ball Grid Array) packages with Pb-free solder and Pb solder due to a vibration. Attaching a weight induced mixed mode stress in the solder ball of a package. To consider the effect of a mixed mode stress occurred in a solder ball and a frequency to fatigue strength of solder ball, a test was carried out with the four kinds of weights which induced the different ratio of nominal normal stress and nominal shear stress in a solder ball (σnn=2, 4, 5, and 6) at various frequencies (10-27 Hz). Based on the nominal shear stress in solder balls, a new evaluation equation to consider the effect of a mixed mode stress in a solder ball was proposed and the scatters of the fatigue strength in Pb-free packages and Pb packages were evaluated with a Weibull distribution. From a successive observation of a cross section during a fatigue test, a position of crack initiation and a propagation path were found out. Although an intermetallic compounds in both of packages were confirmed by an EDX microprobe analysis, they don't contribute to the initiation of a crack in a solder ball.

Original languageEnglish
Pages (from-to)1725-1732
Number of pages8
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume70
Issue number12
DOIs
Publication statusPublished - Dec 2004

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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