Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film

P. E. Phelan, O. Nakabeppu, Kohei Ito, K. Hijikata, T. Ohmori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The thermal boundary resistance, Rbd, at the film/substrate interface is crucially important to the thermal design of electronic and opto-electronic devices made from high-Tc superconducting thin films. Direct measurement of Rbd, however, has been limited to temperatures well above the boiling point of nitrogen, or out of the likely operating range of high-Tc devices. Here, an experiment is carried out on an Er-Ba-Cu-O thin film deposited on an MgO substrate, in which the film is etched into a double meander pattern consisting of two adjacent high-Tc strips. One strip is used as the heater, while the other is used to determine the substrate temperature. In general, the measured values of Rbd are far above those reported earlier; however, due to uncertainties in the temperature determination of the heater strip caused by its current-dependent resistance, much of the data is suspect. The most reliable data indicate that Rbd≈0.1 K cm2 W-1 at ≈100 K. Furthermore, the data suggest that Rbd may be a function of the heat flux.

Original languageEnglish
Title of host publicationHeat Transfer in Superconducting Equipment
PublisherPubl by ASME
Pages33-38
Number of pages6
ISBN (Print)0791810771
Publication statusPublished - Dec 1 1992
EventWinter Annual Meeting of the American Society of Mechanical Engineers - Anaheim, CA, USA
Duration: Nov 8 1992Nov 13 1992

Publication series

NameAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume229
ISSN (Print)0272-5673

Other

OtherWinter Annual Meeting of the American Society of Mechanical Engineers
CityAnaheim, CA, USA
Period11/8/9211/13/92

Fingerprint

Superconducting films
Substrates
Boiling point
Optoelectronic devices
Temperature
Heat flux
Nitrogen
Thin films
Hot Temperature
Experiments

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

Cite this

Phelan, P. E., Nakabeppu, O., Ito, K., Hijikata, K., & Ohmori, T. (1992). Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film. In Heat Transfer in Superconducting Equipment (pp. 33-38). (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; Vol. 229). Publ by ASME.

Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film. / Phelan, P. E.; Nakabeppu, O.; Ito, Kohei; Hijikata, K.; Ohmori, T.

Heat Transfer in Superconducting Equipment. Publ by ASME, 1992. p. 33-38 (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; Vol. 229).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phelan, PE, Nakabeppu, O, Ito, K, Hijikata, K & Ohmori, T 1992, Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film. in Heat Transfer in Superconducting Equipment. American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, vol. 229, Publ by ASME, pp. 33-38, Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, CA, USA, 11/8/92.
Phelan PE, Nakabeppu O, Ito K, Hijikata K, Ohmori T. Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film. In Heat Transfer in Superconducting Equipment. Publ by ASME. 1992. p. 33-38. (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD).
Phelan, P. E. ; Nakabeppu, O. ; Ito, Kohei ; Hijikata, K. ; Ohmori, T. / Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film. Heat Transfer in Superconducting Equipment. Publ by ASME, 1992. pp. 33-38 (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD).
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