Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc thin film

P. E. Phelan; Y. Song; O. Nakabeppu; K. Ito; K. Hijikata; T. Ohmori; K. Torikoshi

doi:10.1115/1.2911440

Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-T_c thin film

P. E. Phelan, Y. Song, O. Nakabeppu, K. Ito, K. Hijikata, T. Ohmori, K. Torikoshi

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1038-1041
Number of pages	4
Journal	Journal of Heat Transfer
Volume	116
Issue number	4
DOIs	https://doi.org/10.1115/1.2911440
Publication status	Published - Nov 1994
Externally published	Yes

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1115/1.2911440

Cite this

@article{441da0f379194e5598d05524eda78fc6,

title = "Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc thin film",

author = "Phelan, {P. E.} and Y. Song and O. Nakabeppu and K. Ito and K. Hijikata and T. Ohmori and K. Torikoshi",

year = "1994",

month = nov,

doi = "10.1115/1.2911440",

language = "English",

volume = "116",

pages = "1038--1041",

journal = "Journal of Heat Transfer",

issn = "0022-1481",

publisher = "American Society of Mechanical Engineers(ASME)",

number = "4",

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TY - JOUR

T1 - Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc thin film

AU - Phelan, P. E.

AU - Song, Y.

AU - Nakabeppu, O.

AU - Ito, K.

AU - Hijikata, K.

AU - Ohmori, T.

AU - Torikoshi, K.

PY - 1994/11

Y1 - 1994/11

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U2 - 10.1115/1.2911440

DO - 10.1115/1.2911440

M3 - Article

AN - SCOPUS:85002647755

VL - 116

SP - 1038

EP - 1041

JO - Journal of Heat Transfer

JF - Journal of Heat Transfer

SN - 0022-1481

IS - 4

ER -

Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc thin film

All Science Journal Classification (ASJC) codes

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Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-T_c thin film