Fingerprint
Dive into the research topics of 'Finite element analysis of corrugated board under bending stress'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Finite element analysis of corrugated board under bending stress
Jongmin Park, Ghiseok Kim, Soonhong Kwon, Sungwon Chung, Soongoo Kwon, Wonsick Choi, Muneshi Mitsuoka, Eiji Inoue, Takashi Okayasu, Jungseob Choe
Research output: Contribution to journal › Article › peer-review
9
Citations
(Scopus)