Fluorinated polyimide fabrication by magnetically controlled reactive ion etching (MC RIE)

A. Furuya, F. Shimokawa, T. Matsuura, R. Sawada

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

This paper describes the etching rates and morphologies of etched surfaces of fluorinated polyimides having fluorine concentrations, when a magnetic field parallel to the cathode surface was varied during magnetically controlled reactive ion etching (MC RIE). The fluorine concentration of fluorinated polyimides is a key parameter used to control the etching rate in MC RIE and the etching rate can also be increased by applying a high magnetic field. The etching rate was maximum when the fluorine concentration was 15-23 wt%, and the peaks became sharper as the magnetic field increased. The surface morphology also became smoother with increasing magnetic field, and SEM observation revealed that the surface morphology of 23 wt% fluorine polyimide was smoothest when a high etching rate and a high magnetic field were used.

Original languageEnglish
Article number004
Pages (from-to)67-73
Number of pages7
JournalJournal of Micromechanics and Microengineering
Volume4
Issue number2
DOIs
Publication statusPublished - Dec 1 1994

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Fluorinated polyimide fabrication by magnetically controlled reactive ion etching (MC RIE)'. Together they form a unique fingerprint.

  • Cite this