Fluorinated polyimide fabrication by magnetically controlled reactive ion etching (MC RIE)

A. Furuya, F. Shimokawa, T. Matsuura, R. Sawada

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)

    Abstract

    This paper describes the etching rates and morphologies of etched surfaces of fluorinated polyimides having fluorine concentrations, when a magnetic field parallel to the cathode surface was varied during magnetically controlled reactive ion etching (MC RIE). The fluorine concentration of fluorinated polyimides is a key parameter used to control the etching rate in MC RIE and the etching rate can also be increased by applying a high magnetic field. The etching rate was maximum when the fluorine concentration was 15-23 wt%, and the peaks became sharper as the magnetic field increased. The surface morphology also became smoother with increasing magnetic field, and SEM observation revealed that the surface morphology of 23 wt% fluorine polyimide was smoothest when a high etching rate and a high magnetic field were used.

    Original languageEnglish
    Article number004
    Pages (from-to)67-73
    Number of pages7
    JournalJournal of Micromechanics and Microengineering
    Volume4
    Issue number2
    DOIs
    Publication statusPublished - Dec 1 1994

    All Science Journal Classification (ASJC) codes

    • Electronic, Optical and Magnetic Materials
    • Mechanics of Materials
    • Mechanical Engineering
    • Electrical and Electronic Engineering

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