TY - GEN
T1 - FolDTronics Demo
T2 - 2019 CHI Conference on Human Factors in Computing Systems, CHI EA 2019
AU - Yamaoka, Junichi
AU - Kawahara, Yoshihiro
AU - Dogan, Mustafa Doga
AU - Kakehi, Yasuaki
AU - Bulovic, Katarina
AU - Mueller, Stefanie
AU - Saito, Kazuya
N1 - Publisher Copyright:
© 2019 Copyright held by the owner/author(s). ACM
Copyright:
Copyright 2019 Elsevier B.V., All rights reserved.
PY - 2019/5/2
Y1 - 2019/5/2
N2 - We present FoldTronics, a 2D-cutting based fabrication technique to integrate electronics into 3D folded objects. The key idea is to cut and perforate a 2D sheet using a cutting plotter to make it foldable into a 3D honeycomb structure; before folding, users place the electronic components and circuitry onto the sheet. The fabrication process only takes a few minutes allowing to rapidly prototype functional interactive devices. The resulting objects are lightweight and rigid, thus allowing for weight-sensitive and force-sensitive applications. Due to the nature of honeycombs, the created objects can be folded flat along one axis and thus can be efficiently transported in this compact form factor.
AB - We present FoldTronics, a 2D-cutting based fabrication technique to integrate electronics into 3D folded objects. The key idea is to cut and perforate a 2D sheet using a cutting plotter to make it foldable into a 3D honeycomb structure; before folding, users place the electronic components and circuitry onto the sheet. The fabrication process only takes a few minutes allowing to rapidly prototype functional interactive devices. The resulting objects are lightweight and rigid, thus allowing for weight-sensitive and force-sensitive applications. Due to the nature of honeycombs, the created objects can be folded flat along one axis and thus can be efficiently transported in this compact form factor.
UR - http://www.scopus.com/inward/record.url?scp=85067309755&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067309755&partnerID=8YFLogxK
U2 - 10.1145/3290607.3313242
DO - 10.1145/3290607.3313242
M3 - Conference contribution
AN - SCOPUS:85067309755
T3 - Conference on Human Factors in Computing Systems - Proceedings
BT - CHI EA 2019 - Extended Abstracts of the 2019 CHI Conference on Human Factors in Computing Systems
PB - Association for Computing Machinery
Y2 - 4 May 2019 through 9 May 2019
ER -