TY - GEN
T1 - Force measurement using quartz crystal resonator integrated with sample clamping unit
AU - Sakuma, Shinya
AU - Hasegawa, Noriaki
AU - Murozaki, Yuichi
AU - Arai, Fumihito
N1 - Publisher Copyright:
© 2017 IEEE.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - In this paper, we propose a mechanical characterization system using a load sensing chip which consists a sample clamping integrated with a load sensor. In order to measure the mechanical characteristics of thin membrane, there are two keys for force measurement; a wide measurement range and the clamping method of thin sample. To meet these requirements, we integrate the load sensor using quartz crystal resonator (QCR) with the microfluidic suction device as a sample clamping unit. In order to obtain the high resolution for force sensing, we evaluated the effectiveness of thickness of QCR on the sensitivity. By using the thinner QCR of 15 pm, we achieved the 96812.7 Hz/N as the sensitivity of QCR load sensor. We fabricated the proposed load sensing chip using thinner QCR, and measured the tensile force of ILM model using the constructed measurement system.
AB - In this paper, we propose a mechanical characterization system using a load sensing chip which consists a sample clamping integrated with a load sensor. In order to measure the mechanical characteristics of thin membrane, there are two keys for force measurement; a wide measurement range and the clamping method of thin sample. To meet these requirements, we integrate the load sensor using quartz crystal resonator (QCR) with the microfluidic suction device as a sample clamping unit. In order to obtain the high resolution for force sensing, we evaluated the effectiveness of thickness of QCR on the sensitivity. By using the thinner QCR of 15 pm, we achieved the 96812.7 Hz/N as the sensitivity of QCR load sensor. We fabricated the proposed load sensing chip using thinner QCR, and measured the tensile force of ILM model using the constructed measurement system.
UR - http://www.scopus.com/inward/record.url?scp=85050546225&partnerID=8YFLogxK
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U2 - 10.1109/CBS.2017.8266098
DO - 10.1109/CBS.2017.8266098
M3 - Conference contribution
AN - SCOPUS:85050546225
T3 - 2017 IEEE International Conference on Cyborg and Bionic Systems, CBS 2017
SP - 198
EP - 201
BT - 2017 IEEE International Conference on Cyborg and Bionic Systems, CBS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE International Conference on Cyborg and Bionic Systems, CBS 2017
Y2 - 17 October 2017 through 19 October 2017
ER -