Abstract
High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn 5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.
| Original language | English |
|---|---|
| Title of host publication | PRICM7 |
| Pages | 2450-2454 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - Aug 17 2010 |
| Event | 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, Australia Duration: Aug 2 2010 → Aug 6 2010 |
Publication series
| Name | Materials Science Forum |
|---|---|
| Volume | 654-656 |
| ISSN (Print) | 0255-5476 |
Other
| Other | 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 |
|---|---|
| Country | Australia |
| City | Cairns, QLD |
| Period | 8/2/10 → 8/6/10 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. / Mu, Dekui; Tsukamoto, Hideaki; Huang, Han; Nogita, Kazuhiro.
PRICM7. 2010. p. 2450-2454 (Materials Science Forum; Vol. 654-656).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints
AU - Mu, Dekui
AU - Tsukamoto, Hideaki
AU - Huang, Han
AU - Nogita, Kazuhiro
PY - 2010/8/17
Y1 - 2010/8/17
N2 - High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn 5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.
AB - High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn 5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.
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U2 - 10.4028/www.scientific.net/MSF.654-656.2450
DO - 10.4028/www.scientific.net/MSF.654-656.2450
M3 - Conference contribution
AN - SCOPUS:77955483665
SN - 0878492550
SN - 9780878492558
T3 - Materials Science Forum
SP - 2450
EP - 2454
BT - PRICM7
ER -