Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints

Dekui Mu, Hideaki Tsukamoto, Han Huang, Kazuhiro Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn 5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

Original languageEnglish
Title of host publicationPRICM7
Pages2450-2454
Number of pages5
DOIs
Publication statusPublished - Aug 17 2010
Event7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, Australia
Duration: Aug 2 2010Aug 6 2010

Publication series

NameMaterials Science Forum
Volume654-656
ISSN (Print)0255-5476

Other

Other7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
CountryAustralia
CityCairns, QLD
Period8/2/108/6/10

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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