Frictional characterization of chemical-mechanical polishing pad surface and diamond conditioner wear

Yohei Yamada, Masanori Kawakubo, Osamu Hirai, Nobuhiro Konishi, Syuhei Kurokawa, Toshiro Doi

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

We evaluated a contact metrology instrument used in chemical-mechanical polishing (CMP) systems for high-volume manufacture and examined in situ coefficient of friction (COF) monitoring to identify the tribology of CMP, and subsequently to determine the useful lifespan of consumables. The results showed that the direct measurement of the wear of the pad allowed for an accurate determination of both pad thickness and the ideal time to replace the pad and conditioner disk based on pad wear rate. We also presented a clear correlation between the working grid area of the conditioner disk and the tribological behavior of the pad break-in procedure, leading to the result showing that the variation in tungsten film removal rate decreased as the working grid density of the conditioner disk increased. This study has proven the effectiveness of measuring friction force for better CMP control.

Original languageEnglish
Pages (from-to)6282-6287
Number of pages6
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume47
Issue number8 PART 1
DOIs
Publication statusPublished - Aug 8 2008

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Chemical mechanical polishing
polishing
Diamonds
diamonds
Wear of materials
Friction
Tribology
grids
Tungsten
tribology
Monitoring
coefficient of friction
metrology
tungsten
friction

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Frictional characterization of chemical-mechanical polishing pad surface and diamond conditioner wear. / Yamada, Yohei; Kawakubo, Masanori; Hirai, Osamu; Konishi, Nobuhiro; Kurokawa, Syuhei; Doi, Toshiro.

In: Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, Vol. 47, No. 8 PART 1, 08.08.2008, p. 6282-6287.

Research output: Contribution to journalArticle

@article{6f8974b07a804d379cd336b7012b40ec,
title = "Frictional characterization of chemical-mechanical polishing pad surface and diamond conditioner wear",
abstract = "We evaluated a contact metrology instrument used in chemical-mechanical polishing (CMP) systems for high-volume manufacture and examined in situ coefficient of friction (COF) monitoring to identify the tribology of CMP, and subsequently to determine the useful lifespan of consumables. The results showed that the direct measurement of the wear of the pad allowed for an accurate determination of both pad thickness and the ideal time to replace the pad and conditioner disk based on pad wear rate. We also presented a clear correlation between the working grid area of the conditioner disk and the tribological behavior of the pad break-in procedure, leading to the result showing that the variation in tungsten film removal rate decreased as the working grid density of the conditioner disk increased. This study has proven the effectiveness of measuring friction force for better CMP control.",
author = "Yohei Yamada and Masanori Kawakubo and Osamu Hirai and Nobuhiro Konishi and Syuhei Kurokawa and Toshiro Doi",
year = "2008",
month = "8",
day = "8",
doi = "10.1143/JJAP.47.6282",
language = "English",
volume = "47",
pages = "6282--6287",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Institute of Physics",
number = "8 PART 1",

}

TY - JOUR

T1 - Frictional characterization of chemical-mechanical polishing pad surface and diamond conditioner wear

AU - Yamada, Yohei

AU - Kawakubo, Masanori

AU - Hirai, Osamu

AU - Konishi, Nobuhiro

AU - Kurokawa, Syuhei

AU - Doi, Toshiro

PY - 2008/8/8

Y1 - 2008/8/8

N2 - We evaluated a contact metrology instrument used in chemical-mechanical polishing (CMP) systems for high-volume manufacture and examined in situ coefficient of friction (COF) monitoring to identify the tribology of CMP, and subsequently to determine the useful lifespan of consumables. The results showed that the direct measurement of the wear of the pad allowed for an accurate determination of both pad thickness and the ideal time to replace the pad and conditioner disk based on pad wear rate. We also presented a clear correlation between the working grid area of the conditioner disk and the tribological behavior of the pad break-in procedure, leading to the result showing that the variation in tungsten film removal rate decreased as the working grid density of the conditioner disk increased. This study has proven the effectiveness of measuring friction force for better CMP control.

AB - We evaluated a contact metrology instrument used in chemical-mechanical polishing (CMP) systems for high-volume manufacture and examined in situ coefficient of friction (COF) monitoring to identify the tribology of CMP, and subsequently to determine the useful lifespan of consumables. The results showed that the direct measurement of the wear of the pad allowed for an accurate determination of both pad thickness and the ideal time to replace the pad and conditioner disk based on pad wear rate. We also presented a clear correlation between the working grid area of the conditioner disk and the tribological behavior of the pad break-in procedure, leading to the result showing that the variation in tungsten film removal rate decreased as the working grid density of the conditioner disk increased. This study has proven the effectiveness of measuring friction force for better CMP control.

UR - http://www.scopus.com/inward/record.url?scp=55149115151&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=55149115151&partnerID=8YFLogxK

U2 - 10.1143/JJAP.47.6282

DO - 10.1143/JJAP.47.6282

M3 - Article

VL - 47

SP - 6282

EP - 6287

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 8 PART 1

ER -