Gettering of crystalline defects in Si by bending

Renshi Sawada, T. Karaki, J. Watanabe

    Research output: Contribution to journalArticlepeer-review

    1 Citation (Scopus)

    Abstract

    Suppression of oxidation-induced stacking faults and microdefects in a Si wafer, subjected to bending during thermal oxidation, was studied. Straight dislocations were introduced only at the neutral plane in Si bulk, during bending in a furnace and retained as sinks through all subsequent high-temperature processings, thereby continuing to suppress the formation of oxidation-induced stacking faults and microdefects. Gettering while applying bending stress to the wafer is described, including the formation mechanism for dislocations at the neutral region.

    Original languageEnglish
    Pages (from-to)368-369
    Number of pages2
    JournalApplied Physics Letters
    Volume38
    Issue number5
    DOIs
    Publication statusPublished - Dec 1 1981

    All Science Journal Classification (ASJC) codes

    • Physics and Astronomy (miscellaneous)

    Fingerprint Dive into the research topics of 'Gettering of crystalline defects in Si by bending'. Together they form a unique fingerprint.

    Cite this